In consequence, well established program systems are available both via commercial software houses and from research institutes or universities. Two-dimensional process simulation has achieved a certain degree of maturity. The workshop follows the International "Workshop on Technology CAD Systems" which was held at the Technical University of Vienna in conjunction with SISDEP '93. 5, 199.5, in conjunction with the 6th International Conference on "Simulation of Semiconductor Devices and Processes" (SISDEP '9.5). ISBN-13:978-3-7091-7430-2 e-ISBN-13:978-3-7091-6905-6 DOl: 10.1007/978-3-7091-6905-6ĮDITORIAL This volume contains the Proceedings of the International "Workshop on 3D Process Simulation" which was held at the Campus of the University of Erlangen-Nuremberg in Erlangen on September. Typesetting: Camera ready by authors Printed on acid-free and chlorine free bleached paper © 1995 Springer-Verlag/Wien Softcover reprint of the hardcover 1st edition 1995 All rights are reserved, whether the whole or part of the material is concerned, specifically those of translation, reprinting, re-use of illustrations, broadcasting, reproduction by photocopying machines or similar means, and storage in data banks. Lorenz Fraunhofer-Institut fur Integrierte Schaltungen Bauelementetechnologie Schottkystrasse 10 D-91058 Erlangen Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. If the eMMC is parititioned and has an OS, u-boot will launch right into that.Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. If a dongle with Armbian is present in one of the USB host slots, it should boot from the dongle.īooting from USB if an OS is present on the eMMC You can use minicom on a host computer to watch the boot process and get a login screen With a clean board, it's necessary to start the board from a host computer using FEL mode. Once flashed, it's necessary to add the Recore device tree to the right folder.Ĭp sun50i-a64-recore.dtb /media/xxx/boot/dtb/allwinner/ Starting with Armbian Buster Server for Pine 64 (kernel 5.4) Xz -v -d -c Refactor-recore-v3.0. | dd of=/dev/mmcblk0Īfter that, make sure you flash the right u-boot version. Use dd to do a direct transfer of the image from the USB drive to eMMC. Get the latest ReFactor image from here: Īssuming you have managed to boot Recore from a USB flash drive and you have the ReFactor image available in the same folder, you can ReFactor Flashing ReFactor from a USB drive If you want to update that, here are the steps: Recore should come pre-flashed with ReFactor image. This document is for Revision A3, please see Recore_A2 for the previous version. 5.3.3.3 On-board thermistor source impedance.5.3.3.1 Ethernet slow at appearing, limited to 100 MB/s.5.2.3 5V Buck converter ripple and noise.3.4.4 Giving right privileges for AR100 restart.3.2.1 Booting from USB if an OS is present on the eMMC.3.1.1 Flashing ReFactor from a USB drive.
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